DAC7562T datasheet(5/60 Pages) TI1

5 / 60 page

DAC7562T, DAC7563T, DAC8162T

DAC8163T, DAC8562T, DAC8563T

www.ti.com

SLASE61A – SEPTEMBER 2015 – REVISED OCTOBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

(1)

Over operating ambient temperature range (unless otherwise noted).

MIN

MAX

UNIT

AVDD to GND

–0.3

CLR, DIN, LDAC, SCLK and SYNC input voltage to GND

–0.3

AVDD + 0.3

VOUT[A, B] to GND

–0.3

AVDD + 0.3

VREFIN/VREFOUT to GND

–0.3

AVDD + 0.3

Operating temperature range

–40

125

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

±500

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

POWER SUPPLY

Supply voltage

AVDD to GND

2.7

5.5

DIGITAL INPUTS

Digital input voltage

CLR, DIN, LDAC, SCLK and SYNC

AVDD

REFERENCE INPUT

VREFIN

Reference input voltage

AVDD

TEMPERATURE RANGE

Operating ambient temperature

–40

125

°C

7.4 Thermal Information

DAC756xT, DAC816xT, DAC856xT

THERMAL METRIC

DSC (WSON)

DGS (VSSOP)

UNIT

10 PINS

RθJA

Junction-to-ambient thermal resistance

62.8

173.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

44.3

48.5

°C/W

RθJB

Junction-to-board thermal resistance

26.5

79.9

°C/W

ψJT

Junction-to-top characterization parameter

0.4

1.7

°C/W

ψJB

Junction-to-board characterization parameter

25.5

68.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

46.2

N/A

°C/W

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