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C0805H393DGGAETU Scheda tecnica(PDF) 20 Page - Kemet Corporation

Il numero della parte C0805H393DGGAETU
Spiegazioni elettronici  Surface Mount Multilayer Ceramic Chip Capacitors
PDF  26 Pages
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Produttore elettronici  KEMET [Kemet Corporation]
Homepage  http://www.kemet.com
Logo KEMET - Kemet Corporation

C0805H393DGGAETU Scheda tecnica(HTML) 20 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1069_C0G_HV_HT_200C • 3/24/2016 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
24 mm
0.1 to 1.6 Newton (10 to 160 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape
Maximum
Width (mm) Rotation ( °T)
8,12
20
16 – 200
10
Tape
Maximum
Width (mm) Rotation ( °S)
8,12
20
16 – 56
10
72 – 200
5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
R
R
Bending
Radius
Embossed
Carrier
Punched
Carrier



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