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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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MPC875EC Scheda tecnica(PDF) 81 Page - Freescale Semiconductor, Inc |
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MPC875EC Scheda tecnica(HTML) 81 Page - Freescale Semiconductor, Inc |
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81 / 84 page  MPC875/MPC870 Hardware Specifications, Rev. 3.0 Freescale Semiconductor PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE 81 Mechanical Data and Ordering Information 16.2 Mechanical Dimensions of the PBGA Package Figure 69 shows the mechanical dimensions of the PBGA package. Figure 69. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package Note: Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC875/870VRXXX. Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC875/870ZTXXX. 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994. 3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A. 4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. NOTES: |
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