IXD_614

12

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R06

5.4 Mechanical Dimensions

5.4.1 SI (8-Pin Power SOIC with Exposed Metal Back)

carrying current.

5.4.2 SI Package Tape & Reel Information

Recommended PCB Land Pattern

Dimensions

mm

(inches)

1.346 ± 0.076

(0.053 ± 0.003)

0.051 MIN - 0.254 MAX

(0.002 MIN - 0.010 MAX)

4.928 ± 0.254

(0.194 ± 0.010)

Pin 1

0.406 ± 0.076

(0.016 ± 0.003)

5.994 ± 0.254

(0.236 ± 0.010)

3.937 ± 0.254

(0.155 ± 0.010)

1.270 REF

(0.050)

0.762 ± 0.254

(0.030 ± 0.010)

7º

2.540 ± 0.254

(0.100 ± 0.010)

3.556 ± 0.254

(0.140 ±0.010)

1.27

(0.050)

5.40

(0.209)

1.55

(0.061)

0.60

(0.024)

2.75

(0.108)

3.80

(0.150)

Dimensions

mm

(inches)

NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

K

(0.083)

W=12.00

(0.472)

B

(0.209)

User Direction of Feed

A

(0.256)

P=8.00

(0.315)