© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

C1069_C0G_HV_HT_200C • 3/24/2016 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 2B – Bulk Packaging Quantities

Packaging Type

Loose Packaging

Secure Packaging

Bulk Bag (default)

7282 / 7292

Case Size

Chip Thickness

(mm)

Packaging Quantities (pieces/unit packaging)

EIA (in)

Metric (mm)

Minimum

Maximum

Minimum

Maximum

0402

1005

All

1

50,000

1

368

0603

1608

368

0805

2012

100

1206

3216

≤ 1.25 (nominal)

126

1206

3216

> 1.25 (nominal)

50

1210

3225

All

80

1808

4520

20,000

50

1812

4532

42

1825

4564

20

2220

5650

20

2225

5664

20

1

The "Packaging C-Spec" is a 4-digit code which identifies the packaging type. When ordering, the proper code must be included in the 15th through 18th

character positions of the ordering code. See "Ordering Information" section of this document for further details. Product ordered without a packaging C-Spec will

default to our standard " bulk bag" packaging.

2

A packaging C-Spec (see note 1 above) is not required For "bulk bag" packaging (excluding Anti-Static Bulk Bag). The 15th through 18th character positions of

the ordering code should be left blank. All product ordered without a packaging C-Spec will default to out standard "bulk bag" packaging.

3

Also commonly referred to as “Chip Carrier” or “Molded Tray”. All tray packaging options offer static protection.