IXD_604

R07

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13

5.4.6 Tape & Reel Information for D2 Package

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

5.00 BSC

(0.197 BSC)

4.00 BSC

(0.157 BSC)

0.80 / 1.00

(0.031 / 0.039)

0.10

(0.004)

0.95 BSC

(0.037 BSC)

0.74 / 0.83

(0.029 / 0.033)

0.30 / 0.45

(0.012 / 0.018)

3.03 / 3.10

(0.119 / 0.122)

2.53 / 2.60

(0.100 / 0.102)

0.35 / 0.45 x 45º

(0.014 / 0.018 x 45º)

Pin 1

Pin 1

Pin 8

0.20 REF

(0.008 REF)

Recommended PCB Land Pattern

4.50

(0.177)

0.45

(0.018)

1.20

(0.047)

3.10

(0.122)

2.60

(0.102)

0.95

(0.037)

0.35 x 45º

(0.014 x 45º)

NOTE:

The exposed metal pad on the back of the D2 package should

be connected to GND. Pad is not suitable for carrying current.

K

B

5º MAX

A

5º MAX

0.30 ± 0.05

(0.05)

(0.05)

R0.75 TYP

8.00 ± 0.10

2.00 ± 0.05

4.00 ± 0.10 See Note #2

12.00 ± 0.30

5.50 ± 0.05

1.75 ± 0.10

∅1.50 (MIN)

∅1.55 ± 0.05

NOTES:

1. A

2. 10 pitches cumulative tol. ± 0.2mm

3. ( ) Reference dimensions only.

4. Unless otherwise specified, all dimensions in millimeters.

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

For additional information please visit our website at: www.ixysic.com

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated

Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its

products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe

property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-IXD_604-R07

©Copyright 2014, IXYS Integrated Circuits Division

All rights reserved. Printed in USA.

9/25/2014