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CPC1708 Scheda tecnica(PDF) 1 Page - IXYS Corporation |
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CPC1708 Scheda tecnica(HTML) 1 Page - IXYS Corporation |
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1 / 7 page  INTEGRATED CIRCUITS DIVISION DS-CPC1708 - R07 www.ixysic.com 1 Characteristics Features • 11.85A DC Load Current with 5°C/W Heat Sink • Low 0.08 On-Resistance • 60V P Blocking Voltage • 2500V rms Input/Output Isolation • Low Thermal Resistance: JC = 0.35 °C/W • Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications • Low Drive Power Requirements • Arc-Free With No Snubbing Circuits • No EMI/RFI Generation • Machine Insertable, Wave Solderable Applications • Industrial Controls / Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment • Aerospace/Defense Approvals • UL 508 Certified Component: File E69938 • CSA Certified Component: Certificate 1172007 Pin Configuration Description IXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of High Power Solid State Relays. As part of this new family, the CPC1708 single-pole normally open (1-Form-A) DC Solid State Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. Low on-resistance and high load current handling capability make this relay suitable for a variety of high performance DC switching applications. The unique i4-PAC package pioneered by IXYS enables solid state relays to achieve the highest load current and power ratings. This package features an IXYS unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal resistance (0.35°C/W). Ordering Information Switching Characteristics Parameter Rating Units Blocking Voltage 60 VP Load Current, TA=25°C: With 5°C/W Heat Sink 11.85 ADC No Heat Sink 4 On-Resistance (max) 0.08 Thermal Resistance, Junction-to-Case, JC 0.35 °C/W 12 3 4 +- - + Part Description CPC1708J i4-PAC Package (25 per tube) Form-A I F I LOAD 10% 90% t on t off CPC1708 60V Single-Pole, Normally Open DC-Only Power Relay |
Codice articolo simile - CPC1708 |
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