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ABSOLUTE MAXIMUM RATINGS

(1)

Production Data

ADS5541

SBAS307C – MAY 2004 – REVISED FEBRUARY 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

DESIGNATOR

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

ADS5541IPAP

Tray, 160

HTQFP-64

ADS5541

PAP

–40°C to +85°C

ADS5541I

PowerPAD

ADS5541IPAPR

Tape and Reel, 1000

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

(2)

Thermal pad size: 3.5mm × 3.5mm (min), 4mm × 4mm (max).

θ

and pad soldered directly to a JEDEC standard, four-layer, 3in × 3in PCB.

Over operating free-air temperature range, unless otherwise noted.

ADS5541

UNIT

–0.3 to 3.7

V

Supply Voltage

±0.1

V

V

V

V

Operating temperature range

–40 to 85

°C

Junction temperature

105

°C

Storage temperature range

–65 to 150

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

If the input signal can exceed 3.6V, then a resistor greater than or equal to 25

Ω should be added in series with each of the analog input

pins to support input voltages up to 3.8V. For input voltages above 3.8V, the device can only handle transients and the duty cycle of the

overshoot should be limited to less than 5% for inputs up to 3.9V.

(3)

The overshoot duty cycle can be defined as the ratio of the total time of overshoot to the total intended device lifetime, expressed as a

percentage. The total time of overshoot is the integrated time of all overshoot occurences over the lifetime of the device.

2

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