CC1020-RTR1 datasheet(16/95 Pages) TI1

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CC1020

SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015

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4.11 Current Consumption

All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical

specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V,

fC = 14.7456 MHz if nothing else stated.

PARAMETER

MIN

TYP

MAX

UNIT

CONDITION

Power Down mode

0.2

1.8

µA

Oscillator core off

Current Consumption,

19.9

receive mode 433 and 868 MHz

P = –20 dBm

12.3/14.5

The output power is

P = –5 dBm

14.4/17.0

delivered to a 50

Ω single-

Current Consumption,

P = 0 dBm

16.2/20.5

ended load.

transmit mode 433/868 MHz:

P = +5 dBm

20.5/25.1

See Section 5.10.2 for more

details.

P = +10 dBm

27.1

(433 MHz only)

14.7456 MHz, 16 pF load

Current Consumption, crystal oscillator

µA

crystal

14.7456 MHz, 16 pF load

Current Consumption, crystal oscillator and bias

500

µA

crystal

14.7456 MHz, 16 pF load

Current Consumption, crystal oscillator, bias and synthesizer

7.5

crystal

4.12 Thermal Resistance Characteristics for VQFNP Package

NAME

DESCRIPTION

°C/W(1) (2)

RθJC(top)

Junction-to-case (top)

16.2

RθJB

Junction-to-board

6.9

RθJA

Junction-to-free air

30.7

PsiJT

Junction-to-package top

0.2

PsiJB

Junction-to-board

6.9

RθJC(bottom)

Junction-to-case (bottom)

1.0

(1)

°C/W = degrees Celsius per watt.

(2)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R

θJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

Specifications

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