3

10ETF..S QUIET

I2140 rev. A 12/99

www.irf.com

Fig. 1 - Current Rating Characteristics

Fig. 2 - Current Rating Characteristics

Fig. 3 - Forward Power Loss Characteristics

Fig. 4 - Forward Power Loss Characteristics

T

J

Max. Junction Temperature Range

- 40 to 150

°C

T

stg

Max. Storage Temperature Range

- 40 to 150

°C

R

thJC

Max. Thermal Resistance Junction

1.5

°C/W

DC operation

to Case

R

thJA

Max. Thermal Resistance Junction

40

°C/W

to Ambient (PCB Mount)**

T

s

Soldering Temperature

240

°C

wt

Approximate Weight

2 (0.07)

g (oz.)

Case Style

Thermal-Mechanical Specifications

Parameters

10ETF..S

Units

Conditions

For recommended footprint and soldering techniques refer to application note #AN-994

120

125

130

135

140

145

150

02

468

1 0

1 2

30°

60°

90°

120°

180°

Co nd u ctio n Ang le

A v e rag e Fo r w ard C u rre n t ( A )

1 0 E T F. .S S e rie s

R

( D C ) = 1 . 5 ° C /W

thJ C

12 0

12 5

13 0

13 5

14 0

14 5

15 0

02468

1 0

1 2

1 4

1 6

DC

30°

60°

90 °

120 °

180 °

Co nd u ction Perio d

A v era g e Fo rw a rd C u rre n t ( A )

1 0 E T F. .S Se rie s

R

(D C ) = 1 .5 °C/ W

thJ C

0

4

8

12

16

20

04

8

1 2

1 6

DC

180 °

120 °

90 °

60 °

30 °

A v e ra g e Fo rw a rd C u rre n t ( A )

RM S L im it

Co nd u ction Pe riod

1 0 E T F..S Se rie s

T = 150 °C

J

0

2

4

6

8

10

12

14

16

02

46

8

1 0

A v e ra g e Fo rw a rd C u rre n t ( A )

RM S L im it

Co nd uc tio n Ang le

180 °

120 °

90 °

60 °

30 °

1 0 E TF . .S S e rie s

T = 150 °C

J