3

2

1

CPN

CPVSS

INL

INR

SHDN

PGND

VSS

COM

CPP

OUTL

OUTR

A

B

C

0.4 mm TYP

0.4 mm TYP

D

LM48861, LM48861TMBD

www.ti.com

SNAS450B – JUNE 2008 – REVISED MAY 2013

Connection Diagrams

Figure 2. YFQ Package

1.215mm x 1.615mm x 0.6mm

Top View

See Package Number YFQ0012AAA

BUMP DESCRIPTION

Bump

Name

Description

A1

CPP

Charge Pump Flying Capacitor Positive Terminal

A2

PGND

Power Ground

A3

CPN

Charge Pump Flying Capacitor Negative Terminal

B1

Positive Power Supply

B2

SHDN

Active Low Shutdown

B3

Charge Pump Output

C1

OUTL

Left Channel Output

C2

Negative Power Supply

C3

INL

Left Channel Input

D1

OUTR

Right Channel Output

D2

COM

Ground reference for inputs and HP

D3

INR

Right Channel Input

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Copyright © 2008–2013, Texas Instruments Incorporated

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