LP2986 datasheet(5/33 Pages) TI1

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LP2986

www.ti.com

SNVS137I – MARCH 1999 – REVISED SEPTEMBER 2015

6.4 Thermal Information

LP2986

THERMAL METRIC(1)

D (SOIC)

DGK (VSSOP)

NGN (WSON)

UNIT

8 PINS

RθJA

(2)

Junction-to-ambient thermal resistance, High-K

114.4

156.5

37.8(3)

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

61.4

51.0

28.58

°C/W

RθJB

Junction-to-board thermal resistance

55.5

76.5

15.0

°C/W

ψJT

Junction-to-top characterization parameter

9.8

4.9

0.2

°C/W

ψJB

Junction-to-board characterization parameter

54.9

75.2

15.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

4.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Thermal resistance value RθJA is based on the EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal

Conductivity Test Board for Leaded Surface Mount Packages.

(3)

The PCB for the NGN (WSON) package RθJA includes four (4) thermal vias under the exposed thermal pad per EIA/JEDEC JESD51-5.

6.5 Electrical Characteristics

Unless otherwise specified: TJ = 25°C, VIN = VOUT(NOM) + 1 V, IOUT = 1 mA, COUT = 4.7 µF, CIN = 2.2 µF, VSD = 2 V.

LP2986AI-X.X(1)

LP2986I-X.X (1)

PARAMETER

TEST CONDITIONS

UNIT

MIN

TYP

MAX

MIN

TYP

MAX

4.975

5.025

4.95

5.05

Output voltage (5-V

0.1 mA < IOUT < 200 mA

4.96

5.04

4.92

5.08

version)

0.1 mA < IOUT < 200 mA

4.91

5.09

4.86

5.14

–40°C

≤ TJ ≤ 125°C

3.283

3.3

3.317

3.267

3.3

3.333

Output voltage (3.3-V

0.1 mA < IOUT < 200 mA

3.274

3.3

3.326

3.247

3.3

3.353

VOUT

version)

0.1 mA < IOUT < 200 mA

3.241

3.359

3.208

3.392

–40°C

≤ TJ ≤ 125°C

2.985

3.015

2.97

3.03

Output voltage (3-V

0.1 mA < IOUT < 200 mA

2.976

3.024

2.952

3.048

version)

0.1 mA < IOUT < 200 mA

2.946

3.054

2.916

3.084

–40°C

≤ TJ ≤ 125°C

VOUT(NOM) + 1 V ≤ VIN ≤ 16

0.007

0.014

0.007

0.014

Output voltage line

ΔVOUT/ΔVIN

%/V

VOUT(NOM) + 1 V ≤ VIN ≤ 16

regulation

0.032

–40°C

≤ TJ ≤ 125°C

IOUT = 100 µA

3.5

–40°C

≤ TJ ≤ 125°C

IOUT = 75 mA

120

VIN – VOUT

Dropout voltage(2)

IOUT = 75 mA

170

–40°C

≤ TJ ≤ 125°C

IOUT = 200 mA

180

230

180

230

IOUT = 200 mA

350

–40°C

≤ TJ ≤ 125°C

(1)

Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using

Statistical Quality Control (SQC) methods. The limits are used to calculate TI’s Average Outgoing Quality Level (AOQL).

(2)

Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below the value measured with a

1-V differential.

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