LMV7219M7SLASHNOPB datasheet(4/27 Pages) TI1

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LMV7219

SNOS458I – APRIL 2000 – REVISED JUNE 2016

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(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over long term may adversely

affect reliability.

(4)

Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Differential input voltage

± Supply Voltage

Output short circuit duration

See(3)

Supply voltage (V+ - V−)

5.5

Soldering information

Infrared or Convection (20 sec)

260

°C

Wave Soldering (10 sec)

260 (lead temp)

°C

Voltage at input/output pins

(V+) + 0.4

(V−)

− 0.4

Current at input pin(4)

±10

Maximum junction temperature

150

°C

Storage temperature

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±150 V may actually have higher performance.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±150

(1)

The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/RθJA. All numbers apply for packages soldered directly into a PC board.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltages (V+ - V−)

2.7

Ambient Temperature(1)

−40

+85

°C

Junction Temperature

125

°C

PCB Temperature

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LMV7219

UNIT

DBV (SOT23)

DCK (SC70)

5 PINS

RθJA

Junction-to-ambient thermal resistance

209

296

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

170

132

°C/W

RθJB

Junction-to-board thermal resistance

°C/W

ψJT

Junction-to-top characterization parameter

8.6

°C/W

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