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LP3933SL Scheda tecnica(PDF) 2 Page - National Semiconductor (TI) |
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LP3933SL Scheda tecnica(HTML) 2 Page - National Semiconductor (TI) |
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2 / 18 page ![]() Connection Diagrams and Package Mark Information 32-Lead Thin CSP Package, 4.5 x 5.5 x 0.8 mm, 0.5 mm pitch See NS Package Number SLE32A 20080509 20080507 20080508 Package Mark — TOP VIEW Note: The actual physical placement of the package marking will vary from part to part. The package marking “XY” designates the date code. “UZ” and “TT” are NSC internal codes for die manufacturing and assembly traceability. Both will vary considerably. Ordering Information Order Number Package Marking Supplied As LP3933SL LP3933SL 1000 units, Tape-and-Reel LP3933SLX LP3933SL 2500 units, Tape-and-Reel www.national.com 2 |
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