TLV2211, TLV2211Y

Advanced LinCMOS RAILTORAIL

MICROPOWER SINGLE OPERATIONAL AMPLIFIERS

SLOS156E − MAY 1996 − REVISED SEPTEMBER 2006

2

POST OFFICE BOX 655303

description (continued)

SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal

source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that

is optimized for board layout (see Figure 2). Both inputs are separated by GND to prevent coupling or leakage

paths. The OUT and IN− terminals are on the same end of the board to provide negative feedback. Finally, gain

setting resistors and decoupling capacitor are easily placed around the package.

VI

VDD+

OUT

IN −

VDD/GND

IN +

C

RI

RF

GND

V+

VO

1

2

3

4

5

Figure 2. Typical Surface Mount Layout for a Fixed-Gain Noninverting Amplifier