MCP23017-ESLASHML datasheet(39/42 Pages) MICROCHIP

39 / 42 page

 2005-2016 Microchip Technology Inc.

DS20001952C-page 39

MCP23017/MCP23S17

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

Device:

MCP23017:

16-Bit I/O Expander with I2C Interface

MCP23S17:

16-Bit I/O Expander with SPI Interface

Temperature

Range:

-40

C to +125C (Extended)

Package:

Plastic Quad Flat, No Lead Package, 6x6 mm

Body, QFN, 28-lead

Plastic Small Outline, Wide, 7.50 mm Body, SOIC,

28-Lead

Skinny Plastic Dual In-Line, 300 mil Body, SPDIP,

28-Lead

Plastic Shrink Small Outline, 5.30 mm Body,

SSOP, 28-Lead

Tape and Reel

Option:

= Tape and Reel (1)

Blank = Tube

PART NO.

/XX

Package

Temperature

Range

Device

Examples:

MCP23017-E/ML:

Extended temperature,

28LD QFN package

MCP23017T-E/ML:

Extended temperature,

28LD QFN package,

Tape and Reel

MCP23017-E/SP:

Extended temperature ,

28LD SPDIP package

MCP23017-E/SO:

Extended temperature,

28LD SOIC package

MCP23017T-E/SO:

Extended temperature,

28LD SOIC package,

Tape and Reel

MCP23017-E/SS:

Extended temperature,

28LD SSOP package

MCP23017T-E/SS:

Extended temperature,

28LD SSOP package,

Tape and Reel

MCP23S17-E/ML:

Extended temperature,

28LD QFN package

MCP23S17T-E/ML:

Extended temperature,

28LD QFN package,

Tape and Reel

MCP23S17-E/SP:

Extended temperature,

28LD SPDIP package

MCP23S17-E/SO:

Extended temperature,

28LD SOIC package

MCP23S17T-E/SO:

Extended temperature,

28LD SOIC package,

Tape and Reel

MCP23S17-E/SS:

Extended temperature,

28LD SSOP package

MCP23S17T-E/SS:

Extended temperature,

28LD SSOP package

Tape and Reel

–

X (1)

Tape and Reel

Option

Note 1:

Tape and Reel identifier only appears in the

catalog part number description. This identifier

is used for ordering purposes and is not

printed on the device package. Check with

your Microchip Sales Office for package

availability with the Tape and Reel option.

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