 2015 Microchip Technology Inc.

DS20005461A-page 13

HV583

B

A

0.15 C

0.15 C

0.15

C A B

0.08

C

(DATUM B)

(DATUM A)

C

SEATING

PLANE

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 1

0.20 C

0.10 C

Microchip Technology Drawing C04-377-J Rev C Sheet 1 of 2

2X

169X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

169-Ball Thin Fine Pitch Ball Grid Array (7G) - 10x10x1.10 mm Body [TFBGA]

D

D

4

E

E

4

e

169X Øb

A

A2

A1

(Complies with JEDEC Terminal Assignment recommendations)