ISO7340C datasheet(8/37 Pages) TI1

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ISO7340C, ISO7340FC, ISO7341C, ISO7341FC, ISO7342C, ISO7342FC

SLLSEI6F – SEPTEMBER 2014 – REVISED AUGUST 2016

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Product Folder Links: ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

ISO734x

UNIT

DW (SOIC)

16 PINS

RθJA

Junction-to-ambient thermal resistance

78.4

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

°C/W

RθJB

Junction-to-board thermal resistance

°C/W

ψJT

Junction-to-top characterization parameter

15.6

°C/W

ψJB

Junction-to-board characterization parameter

42.5

°C/W

RθJC(bottom)

Junction-to-case(bottom) thermal resistance

n/a

°C/W

7.5 Power Ratings

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, Input a 12.5-MHz 50% duty cycle square wave

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Maximum power dissipation by both sides of ISO7340x

PD1

Maximum power dissipation by side-1 of ISO7340x

PD2

Maximum power dissipation by side-2 of ISO7340x

Maximum power dissipation by both sides of ISO7341x

102

PD1

Maximum power dissipation by side-1 of ISO7341x

PD2

Maximum power dissipation by side-2 of ISO7341x

Maximum power dissipation by both sides of ISO7342x

111

PD1

Maximum power dissipation by side-1 of ISO7342x

55.5

PD2

Maximum power dissipation by side-2 of ISO7342x

55.5

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