NCP500SQL33T1 datasheet(18/20 Pages) ONSEMI

Il numero della parte	NCP500SQL33T1

Spiegazioni elettronici	150 mA CMOS Low Noise Low-Dropout Voltage Regulator

PDF	20 Pages

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Produttore elettronici	ONSEMI [ON Semiconductor]

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NCP500

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PACKAGE DIMENSIONS

TSOP−5

SN SUFFIX

PLASTIC PACKAGE

CASE 483−02

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

4. A AND B DIMENSIONS DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

2.90

3.10 0.1142 0.1220

1.30

1.70 0.0512 0.0669

0.90

1.10 0.0354 0.0433

0.25

0.50 0.0098 0.0197

0.85

1.05 0.0335 0.0413

0.013

0.100 0.0005 0.0040

0.10

0.26 0.0040 0.0102

0.20

0.60 0.0079 0.0236

1.25

1.55 0.0493 0.0610

2.50

3.00 0.0985 0.1181

0.05 (0.002)

THIN SOT23−5/TSOP−5/SC59−5

0.7

0.028

1.0

0.039

0.95

0.037

2.4

0.094

1.9

0.074

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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