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BGS13SL9 Scheda tecnica(PDF) 13 Page - Infineon Technologies AG |
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BGS13SL9 Scheda tecnica(HTML) 13 Page - Infineon Technologies AG |
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13 / 14 page ![]() BGS13SL9 Figure 3: Pin 1 Marking (top view) Stencil apertures Copper Solder mask TSLP-9-3-FP V01 0.25 0.25 0.4 0.4 (stencil thickness 100 µm) Figure 4: Footprint TSLP-9-3 Figure 5: Tape Drawing for TSLP-9-3 Data Sheet 13 Revision 2.4, 2014-5-27 |
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