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74ALVC374 Scheda tecnica(PDF) 13 Page - NXP Semiconductors |
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74ALVC374 Scheda tecnica(HTML) 13 Page - NXP Semiconductors |
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13 / 20 page ![]() 2002 Feb 26 13 Philips Semiconductors Product specification Octal D-type flip-flop; positive edge-trigger; 3-state 74ALVC374 PACKAGE OUTLINES UNIT A max. A1 A2 A3 bp cD (1) E (1) (1) eHE LLp Q Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 SOT163-1 10 20 w M b p detail X Z e 11 1 D y 0.25 075E04 MS-013 pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale X θ A A1 A2 HE L p Q E c L v M A (A ) 3 A SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 97-05-22 99-12-27 |
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