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REF6225 Scheda tecnica(PDF) 22 Page - Texas Instruments |
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REF6225 Scheda tecnica(HTML) 22 Page - Texas Instruments |
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22 / 35 page ![]() ‡ J A D -$ T T P R 9 3 L SS I (23.75 * 10 ) * R (0.15 * 10 ) 9 3 L SS I (27.08 * 10 ) * R (0.25 * 10 ) 9 3 L SS I (31.25 * 10 ) * R (0.25 * 10 ) 9 3 SC SS I (115 * 10 ) * R (4.6 * 10 ) 9 3 SC SS I (80 * 10 ) * R (3 * 10 ) REF(MAX) REF(MIN) 6 REF V V Drift 10 (ppm) V Temperature Range § · x ¨ ¸ x © ¹ 22 REF6225, REF6230, REF6233, REF6241, REF6245, REF6250 SBOS748 – SEPTEMBER 2016 www.ti.com Product Folder Links: REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Feature Description (continued) 8.3.2 Temperature Drift The REF62xx family is designed for minimal drift error, defined as the change in output voltage over temperature. The drift is calculated using the box method, as described by the following equation: (3) 8.3.3 Load Current The REF6225, REF6230, REF6233 and REF6241 are specified to deliver current load of ±4 mA. The REF6245 is specified to deliver ±3.5 mA, and the REF6250 is specified to deliver ±3 mA. The REF62xx are protected from short circuits at the output by limiting the output short-circuit current. The short-circuit current limit (ISC) of the REF62xx family of devices is adjusted by connecting a resistor (RSS) on the SS pin. The short-circuit current limit when the REF62xx device is sourcing current can be calculated as shown in Equation 4: (4) The short circuit current limit when the REF62xx device is sinking is calculated as shown in Equation 5: (5) The recommended output current of the REF62xx also depends on the resistor connected to the SS pin. The recommended output current (sourcing and sinking) for the REF6225, REF6230, REF6233 and REF6241 is given by Equation 6: (6) The recommended output current (sourcing and sinking) for the REF6245 is given by Equation 7: (7) The recommended output current (sourcing and sinking) for the REF6250 is given by Equation 8: (8) The temperature of the device increases according to Equation 9: where: • TJ = junction temperature (°C). • TA = ambient temperature (°C). • PD = power dissipated (W). • RθJA = junction-to-ambient thermal resistance (°C/W). (9) The REF62xx maximum junction temperature must not exceed the absolute maximum rating of 150°C. |
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