Data Sheet

8

Rev. 1.1, 2012-10-19

TLE8080EM

General Product Characteristics

Notes

1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not

designed for continuous repetitive operation.

Note: Within the functional range the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the related electrical characteristics table.

Table 2

Functional Range

Parameter

Symbol

Values

Unit

Note /

Test Condition

Number

Min.

Typ.

Max.

Supply Voltage

V

S

6

–

18

V

–

4.5.1

Junction Temperature

T

j

-40

–

150

°C

–

4.5.2

Table 3

Thermal Resistance

Parameter

Symbol

Values

Unit

Note /

Test Condition

Number

Min.

Typ.

Max.

Junction to Case

R

thJC

–7

–K/W

1)

1) Not subject to production test, specified by design

4.6.1

Junction to Ambient

R

thJA

–29

–

K/W

1) 2)

2) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

4.6.2