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DSC400 Scheda tecnica(PDF) 7 Page - Microchip Technology |
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DSC400 Scheda tecnica(HTML) 7 Page - Microchip Technology |
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7 / 20 page ![]() 2016 Microchip Technology Inc. DS20005612A-page 7 DSC400 4.2 LVDS FIGURE 4-2: Typical LVDS Termination Scheme. If the 100Ω clamping resistor does not exist inside the receiving device, it should be added externally on the PCB and placed as close as possible to the receiver. Note 1: See the Output Waveform section for more information. 2: The addition of IDDCORE and IDDIO provides the total current consumption of the device. TABLE 4-2: LVDS OUTPUTS Parameter Symbol Min. Typ. Max. Units Condition Output Offset Voltage VOS 1.125 — 1.4 V R = 100Ω Differential Delta Offset Voltage ∆VOS —— 50 mV — Peak-to-Peak Output Swing VPP — 350 — mV Single-Ended Output Transition Time (Note 1) tR — 200 — ps Rise Time, 20% to 80%, RL= 50Ω, CL= 2 pF tF — 200 — Fall Time, 20% to 80%, RL= 50Ω, CL= 2 pF Frequency f0 2.3 — 460 MHz Single Frequency Output Duty Cycle SYM 48 — 52 % Differential IO Supply Current (Note 2) IDDIO — 9 12 mA Per Output at 125 MHz. Period Jitter JPER —2.5 — psRMS — Integrated Phase Noise JPH —0.28— psRMS 200 kHz to 20 MHz @ 156.25 MHz — 0.4 — 100 kHz to 20 MHz @ 156.25 MHz — 1.7 2.0 12 kHz to 20 MHz @156.25 MHz 100 Ω 100 Ω Load (receiver IC) |
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