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MIC45116 Scheda tecnica(PDF) 7 Page - Microchip Technology |
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MIC45116 Scheda tecnica(HTML) 7 Page - Microchip Technology |
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7 / 42 page ![]() 2016 Microchip Technology Inc. DS20005571A-page 7 MIC45116 TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Junction Temperature Range TJ –40 — +125 °C Note 1 Maximum Junction Temperature — — — +150 °C — Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 10s Package Thermal Resistances 52-pin 8 mm x 8 mm x 3 mm QFN JA —22 — °C/W Note 2 52-pin 8 mm x 8 mm x 3 mm QFN JC —5 — °C/W Note 2 Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. 2: JA and JC were measured using the MIC45116 evaluation board. |
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