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ADP7158ARDZ-3.0-R7 Scheda tecnica(PDF) 21 Page - Analog Devices |
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ADP7158ARDZ-3.0-R7 Scheda tecnica(HTML) 21 Page - Analog Devices |
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21 / 23 page ![]() ADP7158 Data Sheet Rev. A | Page 20 of 22 PRINTED CIRCUIT BOARD (PCB) LAYOUT CONSIDERATIONS Place the input capacitor as close as possible between the VIN pin and ground. Place the output capacitor as close as possible between the VOUT pin and ground. Place the bypass capacitors (CREG, CREF, and CBYP) for VREG, VREF, and VBYP close to the respec- tive pins (VREG, REF, and BYP) and ground. The use of a 0805, 0603, or 0402 size capacitor achieves the smallest possible footprint solution on boards where area is limited. Maximize the amount of ground metal for the exposed pad, and use as many vias as possible on the component side to improve thermal dissipation. Figure 62. Sample 10-Lead LFCSP PCB Layout Figure 63. Sample 8-Lead SOIC PCB Layout |
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