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MCP8026 Scheda tecnica(PDF) 19 Page - Microchip Technology |
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MCP8026 Scheda tecnica(HTML) 19 Page - Microchip Technology |
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19 / 64 page ![]() 2016 Microchip Technology Inc. DS20005339B-page 19 MCP8025/6 Note: Unless otherwise indicated, TA = +25°C; Junction Temperature (TJ) is approximated by soaking the device under test to an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in junction temperature over the ambient temperature is not significant. FIGURE 2-13: Quiescent Current vs. Temperature (MCP8025). FIGURE 2-14: Quiescent Current vs. Temperature (MCP8026). FIGURE 2-15: 500 ns PWM Dead Time Injection. FIGURE 2-16: Driver RDSON vs. Temperature. FIGURE 2-17: Typical Baud Rate Deviation. 0 200 400 600 800 1000 1200 -45 -20 5 305580 105 130 155 Temperature (°C) CE Low CE High 0 200 400 600 800 1000 1200 -45 -20 5 305580 105 130 155 Temperature (°C) CE Low CE High 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Time (µs) Dead Time PWMxH PWMxL Dead Time 10 12 14 16 18 20 22 24 -45 -20 5 30 55 80 105 130 155 Temperature(°C) High-Side Low-Side -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 -45 -20 5 305580 105 130 155 Temperature ( MIN AVERAGE MAX |
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