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EXAMPLE BOARD LAYOUT

(5.8)

0.05 MAX

AROUND

0.05 MIN

AROUND

16X (1.5)

16X (0.45)

14X (0.65)

(R0.05) TYP

(2.48)

(3.4)

(3.4)

NOTE 9

(5)

NOTE 9

(

0.2) TYP

VIA

(0.65) TYP

(1.3 TYP)

(1.1 TYP)

PowerPAD

TSSOP - 1.2 mm max height

PWP0016D

PLASTIC SMALL OUTLINE

4223219/A 08/2016

SYMM

SYMM

SEE DETAILS

LAND PATTERN EXAMPLE

SCALE:10X

1

8

9

16

METAL COVERED

BY SOLDER MASK

SOLDER MASK

DEFINED PAD

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

9. Size of metal pad may vary due to creepage requirement.

TM

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

SOLDER MASK

DEFINED