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©2016 Integrated Device Technology, Inc

Revision B June 28, 2016

831752 Data Sheet

AC Electrical Characteristics

NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is

mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium

has been reached under these conditions. For additional information, refer to the PCI Express Application Note section in the datasheet.

NOTE: PCI Express Jitter Specifications apply to FCLK and nFCLK and Q, nQ operating as outputs. The source generator used in the PCI

Express Jitter measurements is the Stanford Research Systems CG635 2.0GHz Synthesized Clock Generator.

NOTE 1: Peak-to-Peak jitter after applying system transfer function for the Common Clock Architecture. Maximum limit for PCI Express

NOTE 2: RMS jitter after applying the two evaluation bands to the two transfer functions defined in the Common Clock Architecture and

NOTE 3: RMS jitter after applying system transfer function for the common clock architecture. This specification is based on the PCI Express

Base Specification Revision 0.7, October 2009 and is subject to change pending the final release version of the specification.

NOTE 4: This parameter is guaranteed by characterization. Not tested in production.

Symbol

Parameter

Test Conditions

Minimum

Typical

Maximum

PCIe Industry

Specification

Units

(PCIe Gen 1)

Phase Jitter

Peak-to-Peak;

NOTE 1, 4

ƒ = 100MHz

Evaluation Band: 0Hz - Nyquist

(clock frequency/2)

9.95

15.5

86

ps

(PCIe Gen 2)

Phase Jitter RMS;

NOTE 2, 4

ƒ = 100MHz

High Band: 1.5MHz - Nyquist

(clock frequency/2)

0.82

1.12

3.1

ps

(PCIe Gen 2)

Phase Jitter RMS;

NOTE 2, 4

ƒ = 100MHz

Low Band: 10kHz - 1.5MHz

0.04

0.08

3.0

ps

(PCIe Gen 3)

Phase Jitter RMS;

NOTE 3, 4

ƒ = 100MHz

Evaluation Band: 0Hz - Nyquist

(clock frequency/2)

0.153

0.203

0.8

ps