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Motore di ricerca datesheet componenti elettronici |
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STM32L073CZ Scheda tecnica(PDF) 123 Page - STMicroelectronics |
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STM32L073CZ Scheda tecnica(HTML) 123 Page - STMicroelectronics |
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123 / 139 page  DocID027096 Rev 3 123/139 STM32L073xx Package information 136 Figure 43. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package recommended footprint ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 85. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 84. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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