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STM32F031C6 Scheda tecnica(PDF) 93 Page - STMicroelectronics |
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STM32F031C6 Scheda tecnica(HTML) 93 Page - STMicroelectronics |
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93 / 106 page ![]() DocID025743 Rev 4 93/106 STM32F031x4 STM32F031x6 Package information 102 7.5 WLCSP25 package information WLCSP25 is a 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale package. Figure 43. WLCSP25 package outline 1. Drawing is not to scale. Table 65. WLCSP25 package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - A2 - 0.380 - - 0.0150 - A3(2) - 0.025 - - 0.0010 - b(3) (4) 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 2.388 2.423 2.458 0.0940 0.0954 0.0968 E 2.29 2.325 2.36 0.0902 0.0915 0.0929 e - 0.400 - - 0.0157 - e1 - 1.600 - - 0.0630 - e2 - 1.600 - - 0.0630 - F - 0.4115 - - 0.0162 - G - 0.3625 - - 0.0143 - |
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