CWCBLPM1.S1-MZNY-HL datasheet(15/24 Pages) OSRAM

Motore di ricerca datesheet componenti elettronici

CWCBLPM1.S1-MZNY-HL Scheda tecnica(PDF) 15 Page - OSRAM GmbH

Il numero della parte	CWCBLPM1.S1-MZNY-HL

Spiegazioni elettronici	SMD ceramic package with diffused

PDF	24 Pages

Scroll/Zoom	100%

Produttore elettronici	OSRAM [OSRAM GmbH]

Homepage	http://www.osram.com

Logo

15 / 24 page

Version 1.5

CW CBLPM1.S1

2016-01-25

Recommended Solder Pad 9) page 23

Reflow soldering

Empfohlenes Lötpaddesign 9) Seite 23

Reflow-Löten

Note:

For superior solder joint connectivity results we

recommend soldering under standard nitrogen

atmosphere.

Package not suitable for ultra sonic cleaning.

Anm.:

Um eine verbesserte Lötstellenkontaktierung zu

erreichen, empfehlen wir, unter Standard-

Stickstoffatmosphäre zu löten.

Das Gehäuse ist für Ultraschallreinigung nicht

geeignet.

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