| Motore di ricerca datesheet componenti elettronici |
|
LM4752TS Scheda tecnica(PDF) 13 Page - National Semiconductor (TI) |
|
|
|
|||||||||||||||||||||||||||||
LM4752TS Scheda tecnica(HTML) 13 Page - National Semiconductor (TI) |
|
13 / 18 page ![]() Application Information (Continued) TO-263 HEATSINK DESIGN EXAMPLES: Example 1: (Stereo Single-Ended Output) Given: T A=30˚C T J=150˚C R L=4Ω V S=12V θ JC=2˚C/W P DMAX from PD vs PO Graph: P DMAX ≈ 3.7W Calculating P DMAX: P DMAX = VCC 2 /( π2R L) = (12V) 2 / π2(4Ω)) = 3.65W Calculating Heatsink Thermal Resistance: θ SA < [(T J −TA)/PDMAX]− θJC − θCS θ SA < 120˚C / 3.7W − 2.0˚C/W − 0.2˚C/W = 30.2˚C/W Therefore the recommendation is to use 1.5 x 1.5 square inch of single-sided copper clad. Example 2: (Stereo Single-Ended Output) Given: T A=50˚C T J=150˚C R L=4Ω V S=12V θ JC=2˚C/W P DMAX from PD vs PO Graph: P DMAX ≈ 3.7W Calculating P DMAX: P DMAX = VCC 2 /( π2R L) = (12V) 2 /( π2(4Ω)) = 3.65W Calculating Heatsink Thermal Resistance: θ SA < [(TJ −TA)/PDMAX]− θJC − θCS θ SA < 100˚C / 3.7W − 2.0˚C/W − 0.2˚C/W = 24.8˚C/W Therefore the recommendation is to use 2.0 x 2.0 square inch of single-sided copper clad. Example 3: (Bridged Output) Given: T A=50˚C T J=150˚C R L=8Ω V S=12V θ JC=2˚C/W Calculating P DMAX: P DMAX = 4[VCC 2 /(2 π2R L)] = 4(12V) 2 /(2 π2(8Ω)) = 3.65W Calculating Heatsink Thermal Resistance: θ SA < [(TJ −TA)/PDMAX]− θJC − θCS θ SA < 100˚C / 3.7W − 2.0˚C/W − 0.2˚C/W = 24.8˚C/W Therefore the recommendation is to use 2.0 x 2.0 square inch of single-sided copper clad. Layout and Ground Returns Proper PC board layout is essential for good circuit perfor- mance. When laying out a PC board for an audio power am- plifer, particular attention must be paid to the routing of the output signal ground returns relative to the input signal and bias capacitor grounds. To prevent any ground loops, the ground returns for the output signals should be routed sepa- rately and brought together at the supply ground. The input signal grounds and the bias capacitor ground line should also be routed separately. The 0.1 µF high frequency supply bypass capacitor should be placed as close as possible to the IC. www.national.com 13 |
|
|
Link URL |
| Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | Collegamento alla scheda tecnica | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |