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ACTF8067 Scheda tecnica(PDF) 2 Page - Advanced Crystal Technology

Il numero della parte ACTF8067
Spiegazioni elettronici  RF filter
PDF  2 Pages
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Produttore elettronici  ACT [Advanced Crystal Technology]
Homepage  http://www.actcrystals.com
Logo ACT - Advanced Crystal Technology

ACTF8067 Scheda tecnica(HTML) 2 Page - Advanced Crystal Technology

  ACTF8067 Datasheet HTML 1Page - Advanced Crystal Technology ACTF8067 Datasheet HTML 2Page - Advanced Crystal Technology  
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5. Performance
5-1. Maximum Ratings
Rating
Value
Unit
Input Power Level
P
13
dBm
DC Voltage
VDC
12
V
Operable Temperature Range
TO
-40 to +125
Temp. Range for Specification
TA
-40 to +85
Storage Temperature Range
Tstg
-40 to +125
5-2. Electronic Characteristics
Characteristic
Min.
Typ.
Max.
Unit
Center Frequency
fC
869.000
MHz
Insertion Loss
IL
868 MHz …. 870 MHz
--
2.5
3.5
dB
3dB Bandwidth
BW3
10
11.5
MHz
Pass band Ripple
Δα
868 MHz …. 870 MHz
--
0.5
1.0
dB
Input / Output VSWR
868 MHz …. 870 MHz
1.5
2.0
Group Delay Ripple
868 MHz …. 870 MHz
30
60
ns
Relative Attenuation (relative to IL)
αrel
750.00 MHz …. 856.00 MHz
885.00 MHz …. 905.00 MHz
905.00 MHz ….1500.00 MHz
35
40
45
42
58
55
--
--
--
dB
dB
dB
Input / Output Impedance
50
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling!
NOTE:
1.
The frequency fC is defined as the midpoint between the 3dB frequencies.
2.
Unless noted otherwise, all measurements are made with the filter installed in the specified test fixture that is
connected to a 50Ω test system with VSWR≤2.0:1.
3.
Unless noted otherwise, specifications apply over the entire specified operating temperature range.
4.
The specifications of this device are based on the test circuit shown above and subject to change or obsolescence
without notice.
5.
All equipment designs utilizing this product must be approved by the appropriate government agency prior to
manufacture or sale.
6.
Our liability is only assumed for the Surface Acoustic Wave (SAW) component(s) per se, not for applications,
processes and circuits implemented within components or assemblies.



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