HMC558ALC3BTR-R5 datasheet(4/15 Pages) AD

4 / 15 page

HMC558A

Data Sheet

Rev. 0 | Page 4 of 15

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

RF Input Power

25 dBm

LO Input Power

25 dBm

IF Input Power

25 dBm

IF Source/Sink Current

3 mA

Maximum Junction Temperature

175°C

Continuous PDISS (T = 85°C) (Derate

5.5 mW/°C Above 85°C)

495 mW

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature Range (Soldering 60 sec)

−65°C to +150°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

2500 V (Class 2)

Field Induced Charged Device Model

(FICDM)

1000 V (Class C5)

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 3. Thermal Resistance

Package Type

θJC

Unit

E-12-11

180

°C/W

1 See JEDEC standard JESD51-2 for additional information on optimizing the

thermal impedance (PCB with 3 × 3 vias).

ESD CAUTION

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