AS1370 datasheet(5/28 Pages) AMSCO

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AS1370 − Absolute Maximum Ratings

Stresses beyond those listed in Absolute Maximum Ratings may

cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other

conditions beyond those indicated in Electrical Characteristics

is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

Figure 6:

Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Electrical Parameters

-0.9

+55

SHDN

-0.3

VIN + 0.3

OUT

-0.3

VIN + 0.3

POK

-0.3

VOUT + 0.3

Latch-Up Immunity

-100

+100

Electrostatic Discharge

Electrostatic Discharge HBM

±1.5

MIL 883 E method 3015

Temperature Ranges and Storage Conditions

Thermal Resistance

θJA

°C/W

Junction-to-ambient thermal resistance

is very dependent on application and

board-layout. In situations where high

maximum power dissipation exists,

special attention must be paid to

thermal dissipation during board

design.

Operating Temperature

Range

-40

125

°C

Storage Temperature Range

-65

150

°C

Package Body Temperature

260

°C

The reflow peak soldering temperature

(body temperature) specified is in

accordance with IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded

packages is matte tin (100% Sn).

Relative Humidity

(non-condensing)

585

Moisture Sensitivity Level

Represents a max. floor life time of

“Unlimited”

Absolute Maximum Ratings

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