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P12C508 Scheda tecnica(PDF) 65 Page - Microchip Technology |
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P12C508 Scheda tecnica(HTML) 65 Page - Microchip Technology |
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65 / 84 page ![]() © 1996 Microchip Technology Inc. Advance Information DS40139A-page 65 PIC12C5XX 11.0 PACKAGING INFORMATION 11.1 Package Marking Information 8-Lead PDIP (300 mil) Example Legend: MM...M Microchip part number information XX...X Customer specific information* AA Year code (last 2 digits of calendar year) BB Week code (week of January 1 is week ‘01’) C Facility code of the plant at which wafer is manufactured C = Chandler, Arizona, U.S.A., S = Tempe, Arizona, U.S.A. D Mask revision number E Assembly code of the plant or country of origin in which part was assembled Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 8-Lead SOIC (200 mil) Example TO BE DETERMINED TO BE DETERMINED |
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