ADuCM331WDCPZ datasheet(14/16 Pages) AD

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ADuCM330/ADuCM331

Data Sheet

Rev. C | Page 14 of 16

APPLICATIONS INFORMATION

DESIGN GUIDELINES

Before starting design and layout of the ADuCM330/ADuCM331

on a printed circuit board (PCB), it is recommended that the

designer become familiar with the following guidelines that

describe any special circuit considerations and layout

requirements needed.

POWER AND GROUND RECOMMENDATIONS

Place capacitors that are connecting to the ADuCM330/

ADuCM331 as close to the pins of the device as possible, with

minimal trace length.

Capacitors connected to the 33VDD, AVDD18, and DVDD18

pins must have a low equivalent series resistance (ESR) rating.

All components must be rated accordingly to the temperature

range expected by the application.

EXPOSED PAD THERMAL RECOMMENDATIONS

It is required that the exposed pad on the underside of the

ADuCM330/ADuCM331 be connected to ground to achieve

the best electrical and thermal performance. It is recommended

that the user connect an exposed continuous copper plane on

the PCB to the ADuCM330/ADuCM331 exposed pad, and that

the copper plane has several vias to achieve the lowest possible

resistive thermal path for heat dissipation to flow through the

bottom of the PCB. It is recommended that these vias be solder

filled or plugged.

GENERAL RECOMMENDATIONS

It is highly recommended to use the schematic given with

component values specified (see Figure 3). The component

values shown in Figure 3 are chosen from the characterization

tests and evaluated for optimum performance of the ADuCM330/

ADuCM331.

Configure the GPIOs as inputs with pull-up resistors enabled to

obtain the lowest possible current consumption in hibernate mode.

Set the Cortex-M3 core clock speed to the minimum required

to meet the application requirements.

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