ADP7183ACPZN2.5-R7 datasheet(5/19 Pages) AD

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Data Sheet

ADP7183

Rev. 0 | Page 5 of 19

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN to GND

+0.3 V to −6 V

VOUT to GND

+0.3 V to −VIN

EN to GND

+5.0 V to −6 V

VA to GND

+0.3 V to −6 V

VAFB to GND

+0.3 V to −6 V

VREG to GND

+0.3 V to −2.16 V

SENSE to GND

+0.3 V to −6 V

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP7183 can be damaged when the junction

temperature limits are exceeded. Monitoring ambient temperature

does not guarantee that TJ is within the specified temperature

limits. In applications with high power dissipation and poor

thermal resistance, the maximum ambient temperature may

have to be derated.

In applications with moderate power dissipation and low printed

circuit board (PCB) thermal resistance, the maximum ambient

temperature can exceed the maximum limit as long as the

junction temperature is within specification limits. The junction

temperature (TJ) of the device is dependent on the ambient

temperature (TA), the power dissipation of the device (PD), and

the junction to ambient thermal resistance of the package (θJA).

Use the following equation to calculate the junction temperature

(TJ) from the ambient temperature (TA) and power dissipation (PD):

TJ = TA + (PD × θJA)

The junction to ambient thermal resistance (θJA) of the package

is based on modeling and calculation using a 4-layer board. The

junction to ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The θJA value may vary, depending on

the PCB material, layout, and environmental conditions. The

specified θJA values are based on a 4-layer, 4 in. × 3 in. circuit board.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

CP-8-271

68.8

10.0

°C/W

1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test

board with four thermal vias. See JEDEC JESD51.

ESD CAUTION

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