ADP7182ACPZN-R7 datasheet(27/31 Pages) AD

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Data Sheet

ADP7182

Rev. I | Page 27 of 31

140

120

100

00.7

0.5

0.6

0.4

0.3

0.2

0.1

TOTAL POWER DISSIPATION (W)

500mm2

300mm2

100mm2

25mm2

JEDEC

TJ MAX

Figure 96. Junction Temperature vs. Total Power Dissipation for the

5-Lead TSOT, TA = 50°C

140

120

100

00.40

0.35

0.25

0.30

0.20

0.15

0.10

0.05

TOTAL POWER DISSIPATION (W)

500mm2

300mm2

100mm2

25mm2

JEDEC

TJ MAX

Figure 97. Junction Temperature vs. Total Power Dissipation for the

5-Lead TSOT, TA = 85°C

Thermal Characterization Parameter, ΨJB

When the board temperature is known, use the thermal

characterization parameter, ΨJB, to estimate the junction

temperature rise (see Figure 98 and Figure 100). Maximum

junction temperature (TJ) is calculated from the board temperature

(TB) and power dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

(6)

The typical value of ΨJB is 18.2°C/W for the 8-lead LFCSP package,

44.1°C/W for the 6-lead LFCSP package and 43°C/W for the 5-lead

TSOT package.

140

120

100

TOTAL POWER DISSIPATION (W)

TB = 25°C

TB = 50°C

TB = 85°C

TJ MAX

Figure 98. Junction Temperature vs. Total Power Dissipation for the

8-Lead LFCSP, TA = 85°C

TOTAL POWER DISSIPATION (W)

100

120

140

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

TB = 25°C

TB = 50°C

TB = 65°C

TB = 85°C

TJ MAX

Figure 99. Junction Temperature vs. Total Power Dissipation for the

6-Lead LFCSP, TA = 85°C

140

120

100

TOTAL POWER DISSIPATION (W)

TB = 25°C

TB = 50°C

TB = 85°C

TJ MAX

Figure 100. Junction Temperature vs. Total Power Dissipation for the

5-Lead TSOT, TA = 85°C

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