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NCP623DM Scheda tecnica(PDF) 2 Page - ON Semiconductor |
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NCP623DM Scheda tecnica(HTML) 2 Page - ON Semiconductor |
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2 / 14 page ![]() NCP623 http://onsemi.com 2 GND Figure 1. NCP623 Block Diagram * Current Limit * Antisaturation * Protection VIN VOUT GND Bypass Band Gap Reference ON/OFF On/Off Thermal Shutdown MAXIMUM RATINGS Rating Symbol Value Unit Power Supply Voltage Vin 12 V Power Dissipation and Thermal Resistance Maximum Power Dissipation PD Internally Limited W Case 488AE (QFN6, 3x3) MN Suffix Thermal Resistance, Junction−to−Air Thermal Resistance, Junction−to−Case Case 846A (Micro8) DM Suffix Thermal Resistance, Junction−to−Air Thermal Resistance, Junction−to−Case RqJA RqJC RqJA RqJC 161 19 240 105 °C/W Operating Ambient Temperature Range TA −40 to +85 °C Maximum Junction Temperature TJmax 150 °C Storage Temperature Range Tstg −60 to +150 °C ESD Protection − Human Body Model Machine Model VESD 2000 200 V Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. |
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