TM

Innovative Technology

for a Connected World

Thermoelectric Module

Americas: +1 888.246.9050

Europe: +46.31.704.67.57

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

SuffIx ThIckneSS

flaTneSS &

ParallelISm

hoT face cold face lead lengTh

Ta

0.095” +/- 0.001”

0.001” / 0.001”

lapped

lapped

6.0”

TB

0.095” +/- 0.0005”

0.0005” / 0.0005” lapped

lapped

6.0”

FEaTUrES

• Highheatpumpdensity

• Precisetemperaturecontrol

• Reliablesolidstateoperation

• Nosoundorvibration

• DCoperation

• RoHScompliant

appliCaTionS

• Analyticalinstrumentation

• Clinicaldiagnostics

• Photonicslasersystems

• Electronicenclosurecooling

• Foodandbeveragecooling

• Chillers(liquidcooling)

assembledwithalargenumberofsemiconductorcouplestoachieveahigherheatpumpingcapacity

thanstandardsinglestageTEMs.

Thisproductlineisavailableinmultipleconfigurationsandisidealforapplicationsthatrequirehigher

coolingcapacitieswithlimitedsurfacearea.AssembledwithBismuthTelluridesemiconductormaterial

currentandlargerheat-pumpingapplications.

Performance SPecIfIcaTIonS

Hotsidetemperature(°C)

25

50

Qmax(watts)

95.4

104.8

DeltaTmax(°C)

67

75

Imax(amps)

11.1

11.1

Vmax(volts)

14.5

16.4

Moduleresistance(ohms)

1.20

1.36

SuffIx SealanT

color

TemP range deScrIPTIon

rT

rTV

White

-60to204°C

Non-corrosive,siliconeadhesivesealant

eP

Epoxy

Black

-55to150°C

Lowdensitysyntacticfoamepoxyencapsulant

SEaling opTion