TMP93CS41DF datasheet(44/48 Pages) TOSHIBA

44 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-44

2002-02-20

4.5.4

Flux Cleaning and Ultrasonic Cleaning

(1)

When cleaning circuit boards to remove flux, make sure that no residual

reactive ions such as Na or Cl remain. Note that organic solvents react

with water to generate hydrogen chloride and other corrosive gases which

can degrade device performance.

(2)

Washing devices with water will not cause any problems. However, make

sure that no reactive ions such as sodium and chlorine are left as residues.

Also, be sure to dry devices sufficiently after washing.

(3)

Do not rub device markings with a brush or with your hand during

cleaning or while the devices are still wet from the cleaning agent. Doing

so can rub off the markings.

(4)

The dip cleaning, shower cleaning and steam cleaning processes all

involve the chemical action of a solvent. Use only recommended solvents

for these cleaning methods. When immersing devices in a solvent or

steam bath, make sure that the temperature of the liquid is 50°C or below,

and that the circuit board is removed from the bath within one minute.

(5)

Ultrasonic cleaning should not be used with hermetically-sealed ceramic

packages such as a leadless chip carrier (LCC), pin grid array (PGA) or

charge-coupled device (CCD), because the bonding wires can become

disconnected due to resonance during the cleaning process. Even if a

device package allows ultrasonic cleaning, limit the duration of ultrasonic

cleaning to as short a time as possible, since long hours of ultrasonic

cleaning degrade the adhesion between the mold resin and the frame

material. The following ultrasonic cleaning conditions are recommended:

Frequency: 27 kHz to 29 kHz

Ultrasonic output power: 300 W or less (0.25 W/cm

2 or less)

Cleaning time: 30 seconds or less

Suspend the circuit board in the solvent bath during ultrasonic cleaning

in such a way that the ultrasonic vibrator does not come into direct

contact with the circuit board or the device.

TMP93CS41DF Scheda tecnica(PDF) 44 Page - Toshiba Semiconductor