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LNBP8L Scheda tecnica(PDF) 17 Page - STMicroelectronics |
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LNBP8L Scheda tecnica(HTML) 17 Page - STMicroelectronics |
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17 / 21 page ![]() LNBP8L - LNBP9L - LNBP10L - LNBP11L Package mechanical data 17/21 Note: 1 Controlling dimensions: millimeter. 2 Burrs larger than 0.25 mm are not allowed on the upper surface of the dissipater (FRONT) on the lower surface (REAR) the maximum allowed is: 0.05 mm. 3 The side of the dissipater to be connected to the external dissipater must be flat within 30 µ 4 The leads size is comprehensive of the thickness of the leads finishing material. 5 Package outline exclusive of any mold flashes dimensions and metal burrs. 6 Max resin gate protrusion: 0.5 mm. 7 Max resin protrusion: 0.25 mm. 8 The maximum bent leads allowed, in any direction, is: # 2° if the devices are packed in tube. Table 6. IPPAK mechanical data Dim. (mm.) Min. Typ. Max. A2.20 2.40 A1 0.90 1.10 B0.40 0.60 B2 5.20 5.40 B3 0.70 B5 0.30 B6 1 C0.45 0.60 C2 0.48 0.60 D 6 6.20 E6.40 6.60 e1.27 G4.90 5.25 G1 2.38 2.70 H 15.90 16.30 L 9 9.40 L1 0.80 1.20 L2 0.80 1 V1 10° |
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