LQFP100 datasheet(70/116 Pages) STMICROELECTRONICS

70 / 116 page

Package pinouts and signal descriptions

SPC560B40x/50x, SPC560C40x/50x

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DocID14619 Rev 13

3.19.3

Start-up/Switch-off timings

3.20

Electromagnetic compatibility (EMC) characteristics

Susceptibility tests are performed on a sample basis during product characterization.

3.20.1

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical

application environment and simplified MCU software. It should be noted that good EMC

performance is highly dependent on the user application and the software in particular.

Therefore it is recommended that the user apply EMC software optimization and

prequalification tests in relation with the EMC level requested for his application.



Software recommendations:

The software flowchart must include the management of

runaway conditions such as:

–

Corrupted program counter

–

Unexpected reset

–

Critical data corruption (control registers...)



Prequalification trials:

Most of the common failures (unexpected reset and program

counter corruption) can be reproduced by manually forcing a low state on the reset pin

or the oscillator pins for 1 second.

To complete these trials, ESD stress can be applied directly on the device. When

unexpected behavior is detected, the software can be hardened to prevent

unrecoverable errors occurring (see application note Software Techniques For

Improving Microcontroller EMC Performance (AN1015)).

Table 33. Start-up time/Switch-off time

Symbol

Parameter

Conditions(1)

Value

Unit

Min

Typ

Max

TFLARSTEXIT CC

Delay for Flash module to exit reset mode

Code Flash

—

125

µs

Data Flash

—

125

TFLALPEXIT

T Delay for Flash module to exit low-power

mode

Code Flash

—

0.5

Data Flash

—

0.5

TFLAPDEXIT

T Delay for Flash module to exit power-down

mode

Code Flash

—

Data Flash

—

TFLALPENTRY CC

T Delay for Flash module to enter low-power

mode

Code Flash

—

0.5

Data Flash

—

0.5

TFLAPDENTRY CC

Delay for Flash module to enter power-

down mode

Code Flash

—

1.5

Data Flash

—

1.5

VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified

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