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STM32F302C8 Scheda tecnica(PDF) 129 Page - STMicroelectronics |
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STM32F302C8 Scheda tecnica(HTML) 129 Page - STMicroelectronics |
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129 / 138 page ![]() DocID025147 Rev 6 129/138 STM32F302x6 STM32F302x8 Package information 134 7.4 UFQFPN32 package information Figure 46. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must be connected. It is referred to as pin 0 in Table: Pin definitions. |
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