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ASTMUPC Scheda tecnica(PDF) 2 Page - Abracon Corporation

Il numero della parte ASTMUPC
Spiegazioni elettronici  Industrial control
PDF  10 Pages
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Produttore elettronici  ABRACON [Abracon Corporation]
Homepage  https://abracon.com
Logo ABRACON - Abracon Corporation

ASTMUPC Scheda tecnica(HTML) 2 Page - Abracon Corporation

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• Ethernet, SATA, SAS, PCI Express
• WiFi
• Video
• Computing
• Storage
• Networking
• Telecom
• Industrial control
• Harsh environment (vibration, shock-prone and humid)
ABRACON IS
CERTIFIED
ABRACON IS
ISO9001:2008
CERTIFIED
Pb RoHS/RoHS II compliant
2 Faraday, Suite# B
| Irvine | CA 92618 Revised: 07.22.15
Ph. 949.546.8000
| Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
LLC
ASTMUPC
High Performance, Programmable LVCMOS SMD MEMS Oscillator
ASTMUPC
2.7 x 2.4 x 0.75mm; 3.2 x 2.5 x 0.75mm;
5.0 x 3.2 x 0.75mm; 7.0 x 5.0 x 0.9mm
(Continued)
Absolute Maximum Ratings
Attempted operation outside the absolute maximum ratings may cause permanent damage to the part. Actual
performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.
Thermal Consideration
Note : 1. The 2.7 x 2.4mm Package is compatible with 2.5 x 2.0mm footprint.
Parameters
Min
Typ
Max
Unit
Notes
Output Type
LVCMOS
Duty Cycle
45
55
%
F≤165MHz. All Vdd options
40
60
F>165MHz. All Vdd options
Rise/Fall Time ( Tr /Tf)
1.2
2
ns
15pF load, 10%-90%
Output High Voltage (VOH)
90%*Vdd
V
IOH=-6mA (Vdd=3.3V, 2.8V, 2.5V)
IOH=-3mA (Vdd=1.8V)
Output Low Voltage (VOL)
10%*Vdd
V
IOL=6mA (Vdd=3.3V, 2.8V, 2.5V)
IOL=3mA (Vdd=1.8V)
Input High Voltage(VIH)
70%*Vdd
V
Pin 1
Input Low Voltage(VIL)
30%*Vdd
V
Pin 1
Input Pull-up Impedance ( Zin)
100
250
kΩ
Pin 1, OE logic high or logic low,
ST
logic high
2
MΩ Pin 1, ST logic low
RMS Period Jitter ( Tjitt)
1.5
2
ps
F=75MHz, 156.25MHz, Vdd=2.5V, 2.8V,
3.3V
2
3
F=75MHz, 156.25MHz, Vdd=1.8V
RMS Phase Jitter (random) ( Tphj)
0.5
1
ps
F=10MHz, 156.25MHz, integration
bandwidth=12kHz to 20MHz
Parameters
Min.
Max.
Unit
0
5
1
5
6
-
e
r
u
t
a
r
e
p
m
e
T
e
g
a
r
o
t
S
°C
VDD
V
4
5
.
0
-
Electrostatic Discharge (HBM)
2000
V
Soldering Temperature
(follow standard Pb free soldering guidelines)
260
°C
0
5
1
e
r
u
t
a
r
e
p
m
e
T
n
o
it
c
n
u
J
°C
Package
θJA, 4 Layer Board
(°C/W)
θJA, 2 Layer Board
(°C/W)
θJC, Bottom
(°C/W)
7.0 x 5.0mm
191
263
30
5.0 x 3.2mm
97
199
24
3.2 x 2.5mm
109
212
27
2.7 x 2.4mm (1)
117
222
26



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