Confidential

Datasheet Version 1.0

July

2015. Revision 1.0

MagnaChip Semiconductor Ltd.

3

Pin Configuration

Pin Definitions

Pin#

Name

Description

1

COMP

Compensation Pin for Error Amplifier. Connect a series RC from COMP to GND.

2

FB

Feedback. The FB regulation voltage is 1.25V nominal. Connect an external resistive

voltage divider between the step-up regulator

’s output(VOUT) and GND, with the center tap

connected to FB. Place the divider close to the IC and minimize the trace area to reduce

noise coupling.

3

EN

Chip Enable. Drive EN low to turn off the Boost

4,5,11

(Exposed Pad)

GND

Ground. The Exposed Pad must be soldered to a large PCB and connected to GND for

maximum power dissipation.

6,7

LX

Switch. LX is the drain of the internal MOSFET. Connect the inductor/rectifier diode junction

to LX and minimize the trace area for lower EMI.

8

VOUT

Boost Converter Over Voltage Protection input. Bypass VOUT with a minimum 1uF ceramic

capacitor directly to GND.

9

VIN

Supply Input. Bypass VIN with a minimum 1uF ceramic capacitor directly to GND.

10

SS

charged with a constant current of 5uA. The soft-start capacitor is discharged to ground

when EN is low

Absolute Maximum Ratings

Parameter

Value

Unit

LX, VOUT to GND

-0.3V to 28V

V

VIN, EN, SS, FB to GND

-0.3V to 16.5V

V

COMP to GND

-0.3V to 6.0V

V

Junction Temperature Range

-40 to +150

℃

Storage Temperature Range

-65 to +150

℃

Package Thermal Resistance (JA)

65.9

℃/W

Power Dissipation (Ta=25℃)

1.517

W

Human Body Model(HBM)

2

kV

Machine Model(MM)

200

V

Charged Device Model (CDM)

700

V

Note:

Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation

under these conditions is not implied.

Recommended Operating conditions

Ambient Temperature Range

-40 to +85

℃

Junction Temperature Rnage

-40 to +125

℃

Exposed

PAD

COMP

FB

EN

GND

GND

LX

VOUT

VIN

SS

LX

11

1

2

3

4

5

6

7

8

9

10

3mm x 3mm Ultra thin DFN-10

(Top view)