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M95M01-DF Scheda tecnica(PDF) 49 Page - STMicroelectronics |
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M95M01-DF Scheda tecnica(HTML) 49 Page - STMicroelectronics |
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49 / 51 page ![]() DocID13264 Rev 14 49/51 M95M01-DF M95M01-R Revision history 50 20-Jun-2012 9 Datasheet split into: – M95M01-125 datasheet for automotive products (range 3), – M95M01-DF, M95M01-R (this datasheet) for standard products (range 6). Updated: – WLCSP package dimensions: Figure 44: M95080-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline and Table 60: M95080-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package mechanical data – Cycling and data retention performances (4 million Write cycles, 200- year data retention) – Table 14: DC characteristics updated with 1.7 V values – Table 15: AC characteristics updated with 16 MHz clock Added: – Identification page (M95M01-DF) – 1.7 V/5.5 V device (reference M95M01-DF) Deleted: – Reference M95M01-W3 06-Jul-2012 10 Updated WLCSP package reference from “CT” to “CS”. 3-Sep-2012 11 Fixed some errors in Figure 3: WLCSP connections for M95M01- DFCS6TP/K (top view, marking side, with bumps on the underside) 25-May-2015 12 Replaced “ball” by “bump” in the entire document. Updated Features and WLCSP package figure on cover page. Removed Caution note on UV exposure in Section 1: Description. Updated Figure 3: WLCSP connections for M95M01-DFCS6TP/K (top view, marking side, with bumps on the underside), Figure 4: Block diagram and Figure 14: Page Write (WRITE) sequence. Updated Section 5.1.3: Power-up conditions, Section 5.3: Hold condition, Section 6: Instructions. and Section 7.2: Initial delivery state. Updated Table 7: Absolute maximum ratings and its footnotes. Updated Section 10: Package information with changes in each of Sections 10.1: SO8N package information, 10.2: TSSOP8 package information and 10.8: WLCSP package information. Updated Table 31: Ordering information scheme and added Note: on Engineering samples. Updated Disclaimer. Table 22. Document revision history (continued) Date Revision Changes |
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