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STOD14 Scheda tecnica(PDF) 11 Page - STMicroelectronics

Il numero della parte STOD14
Spiegazioni elettronici  700 mA dual DC-DC converter for powering AMOLED displays
PDF  22 Pages
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Produttore elettronici  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STOD14 Scheda tecnica(HTML) 11 Page - STMicroelectronics

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STOD14
Application Information
Doc ID 023562 Rev 1
11/22
6
Application Information
6.1
Inductor selection
The inductor is the key passive component for switching converters.
For the step-down converter an inductance between 3.3 µH and 6.8 µH is recommended.
For the inverting stage the suggested inductance ranges from 3.3 µH to 4.7 µH.
It is very important to select a proper inductor according to the maximum current the
inductor can handle in order to avoid saturation. The peak current for the step-down and the
inverting can be calculated with the following formulas:
Equation 1
Equation 2
where
VO1 is step-down output voltage
VO2 is inverting output voltage including sign
IO is output current for both DC-DC converters
VIN is input voltage; use minimum of operating voltage
fs is switching frequency; use the minimum value of 1.44 MHz for worst case
η2 is inverter efficiency; typ. 85%
L1 is buck inductor value; including tolerance
L2 is inverter inductor value; including tolerance.
6.2
Input and output capacitor selection
It is recommended to use ceramic capacitors with low ESR as input and output capacitors in
order to filter any disturbance present in the input line and to get stable operation for the
switching converters.
6.3
Recommended PCB layout
The STOD14 is a high frequency power switching device so it requires a proper PCB layout
in order to obtain the necessary stability and optimize line/load regulation and output voltage
ripple. Analog input (VINA) and power input (VINP) must be kept separated and connected
together at the CIN pad only. The input capacitor must be as close as possible to the IC. To
minimize the ground noise, a common ground node for power ground and a different one for
analog ground must be used. The exposed pad is connected to AGND through vias.
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